Intel is presently working to move its entire lineup to the 10nm node. This includes the Core i series, the Xeon server CPUs as well as the mobile U, Y and H lineups. The company is also working to introduce a new hybrid CPU similar to Qualcomm’s big-little design. It will pack one 10nm Sunny Cove high-performance core and four smaller, power-efficient Tremont cores. The whopper, however, is that it will be Intel’s first chip featuring the Foveros 3D packaging technology.
As you can see, the DRAM, CPU, GPU, I/O and the base die are placed on the same SoC to save space, power and cut costs by a notable degree. This chip will be called Lakefield and is expected to launch in the first half of 2020. We’ve seen some early leaks of Lakefield, and today we’ve got a Geekbench 5 score to share.
The listing mentions a five core Intel CPU, and from what we know this can only be Lakefield, with one SunnyCove and four Tremont cores. The base frequency is a decent 3.11GHz and you can expect a boost of around 4.20GHz. There’s no hyper-threading, not surprising considering that design of Lakefield. As for RAM, we’re looking at 2GB of DDR4 memory running at an unspecified frequency.
This is still an early sample, so keep in mind that the clocks and some other specifications will change as the chip moves closer towards the final product. We’ll keep you posted.