At the VLSI symposium held in Tokyo earlier this month, TSMC showcased its custom-built Octa-Core A72 and it became the highlight of the conference. The company presented a research paper titled ‘A 7nm 4GHz Arm®-core-based CoWoS® Chiplet Design for High-Performance Computing’. Let’s have a quick look at some of the key highlights of this custom built chip.
KEY HIGHLIGHTS OF TSMC’s CUSTOM BUILT OCTA-CORE A72 CHIP:
- TSMC’s design consists of a single chip with two chiplets on board. Each chip die is 4.4 mm by 6.2 mm with four Cortex A72 cores.
- The two chiplets are connected to each other through TSMC’s Low-voltage-In-Package-Interconnect (LIPINCON). It is possible to connect more than two chiplets using this design.
- Use of CoWoS enables TSMC to drive down power consumption.
- At a voltage of 1.20, the Cortex core can reach 4 GHz, and the measured maximum speed is 4.2 GHz at 1.375V.
- This TSMC chip is specifically geared towards high-performance computing platforms.
Meanwhile, TSMC is also readying test production of the 5nm chipset which is likely to hit the mass production stage in 2020. Also, TSMC’s 2nm process is expected to enter mass production in 2024. All this new tech from TSMC only shows that the company is always on its toes and is constantly working on new innovative ideas which eventually would yield better products for the consumers in the coming future.